The DWL 66+ from Heidelberg Instruments GmbH is a maskless laser beam direct writing lithography system, operating with a laser diode at wavelength 405 nm and output power of 300mW.
The system is enclosed in a environment chamber to guarantee stable conditions, with a laminar flow and precise temperature control (+- 0.1°C). The stage, whose position is controlled by a laser interferometer, can allocate wafers up to 200 mm in diameter, as well as small samples down to 10mm x 10mm. Depending on the sample to be exposed, either optical or air-gauge autofocus mode can be used.
Two write heads are available in the system, which enable to realize patterns with the minimum features size of 1 μm (Write Mode III) and 0.3 μm (HiRes), respectively. The change from one write head to another takes few minutes. The system is characterized by a high write speed, i.e. 150mm2/min using the “Write Mode III” and 3 mm2/min using the “HiRes”. Owing to its versatility and high write speed, the DWL 66+ can be used for either direct patterns exposure, as well as for masks fabrication.
A spinner and hot plate MCS8 from Suss Microtec, and two wet benches, are also available in the clean room, for photoresist coating and baking, developing, cleaning and wet etch processes.
